Both the soldering iron and the soldering station are welding tools that must be used for soldering electronic products. The soldering station is an upgraded version based on the soldering iron, which is more powerful and more convenient to use.

Do not remove the excess solder from the soldering iron tip before closing the soldering station, the excess tin will protect the tin surface and prevent it from oxidizing while the soldering iron tip is still hot. Do not add any compound to the tin surface.

When soldering, flux is applied to the electrical leads to be soldered, it helps to remove oxidation and prevents airflow to the leads, preventing further oxidation. Solder adheres more easily to unoxidized metal, which will cause the solder to flow evenly over the electrical leads. Since the solder is evenly present in the electrical leads, its conductivity is also improved.

Step 1: We prepare the common tools for tin planting and clean the chip and the corresponding tin planting board hole of the chip. Step 2: Fix the chip on the tin planting board with label paper, and then fill the solder paste with a blade. Step 3: Use tweezers to press the tin planting board and heat it with the nozzle of the hot air gun, make sure to master the temperature of the air gun (generally around 400 degrees), the wind (do not exceed 1.5) and the height (2.5cm). When heating, move left and right slightly to heat the tin planting board evenly. And when the solder paste turns into a spherical shape, it means that the solder paste is melted, and then you can stop it.

Start by applying flux to the pads on the board. Then apply solder to one pin of the chip Use tweezers to clamp both ends of the component, then place the chip and align Hold the chip in place while touching the pads with the tip of the soldering iron so that the solder melts the pins and pads together. Check the alignment of the chips. If it's not in its place, tap with a soldering iron, loosen the pin chip and align the chip properly

One is to make all the models on a large conjoined tin plate; the other is that the mobile phone models correspond to different templates, and the two types of tin plates are used in different ways.

If the solder balls emerge from the tin-planting board during the blowing process, resulting in many points not being planted, use a blade (must be sharp) to flatten the protruding part of the tin-planting board. Then fill the unplanted holes with the solder paste, blow it again with an air gun, and when the solder paste melts, stop heating and you will find that the tin spot size is very uniform.

The difference between SMT soldering and THT soldering is that the former uses SMD assembly technology and the latter uses through-hole lead technology. The former only needs to solder one side of the circuit board, while the latter needs to solder both sides of the circuit board.