The essential tool for mobile phone repair - Tin planting platform

In actual maintenance work, we often encounter replacement chips. Since there are many tin spots on the chip (similar to pins), it is inevitable that the tin spots on the chip will be knocked off during the desoldering process of the chip. In this case, the chip needs reballing. In the process of chip tin planting, the temperature control are strictly required. The temperature determines the success or failure of chip tin planting, and it will seriously damage the IC due to overheating.

tin planting stand

The BGA ball planting fixture can easily scrape tin and ball plant the BGA chip, which solves the difficult problem in the bead planting process of the BGA chip, and improves the efficiency and quality for the chip ball planting .

Due to the high cost of BGA chips, which are precision components and can be reused, the BGA ball planting technology is becoming more and more important. More and more people try to buy ball planting equipment to ball planting

Classification of tin planting equipment

In general, ball planting equipment is divided into two types

Ball planting machine:

The price is more expensive, but the ball planting speed is fast and the ball planting yield is high

Ball planting table (bead planting table, tin planting platform):

Low price, high cost performance, more suitable for individual customers

AiXun share with you the methods and skills of using the tin planting platform.

Tin planting platform brand recommendation

AiXun is recommended for the BGA ball planting platform brand.

AiXun A8-A14 Special CPU IC Reballing Platform Tin Planting Base Repair Kit for iPhone 6-12ProMax

• 3-in-1 Design, integrated positioning, glue removing and tin planting functions together

• Support A8/A9/A10/A11/A12/A13/A14 cpu tin planting and reballing, good partner for iphone repair

• One base + 4 positioning frames, support limitless updates, never out of date

• Strong magnetic absorption base design, more accurate and positioning faster, improve work efficiency

• Accurate positioning, each mesh hole is calibrated based on original drawings to ensure accurate solder joints

How to use the tin planting platform?

4 Easy Steps, look here!

Step 1

Fix the tin planting stencil on the double-layer

positioning frame, and put the bottom motherboard that needs tin planting into the base slot.

Step 2

02 Align the installed double-layer positioning frame

with the positioning column and put it on the base,

and then cover the SIM card base with the tin cover

Step 3

Evenly apply low-temperature solder paste on the stencil, and remove the double-layer positioning middle frame after application.

(Note not to use the hot-air gun to blow the stencil directly)

Step 4

Use a hot-air gun to blow the solder paste until it melts.